HP Inc – Dou Yee Technologies – NAMIC MOU Signing
The National Additive Manufacturing Innovation Cluster (NAMIC), HP Inc, and Dou Yee Technologies, have signed a Memorandum of Understanding (MOU) at the Global AM Summit 2025 to collaborate on advancing the commercial adoption of metal binder jet (MBJ) additive manufacturing (AM) for industrial applications targeting the tooling, automotive, and medical sectors. Through this collaboration, the organisations aim to establish a robust development-to-production workflow for MBJ applications. The collaboration seeks to accelerate qualification processes, define clear transition pathways to scaled manufacturing, and strengthen local manufacturing agility and resilience through digital production capabilities.












