Printed electronics package that has the electrical pads directly printed on the metal layers on which an RF connector is soldered.
Nano Dimension Ltd. (Nasdaq, TASE: NNDM), a leading Printed electronics (PE) / Additively Manufactured Electronics (AME) provider, announced that its technology, DragonFly LDM system and materials were used to develop a 3D printed sealed packaging with electrical pads for Micro-Electromechanical Systems (MEMS).
The printed electronics package has the electrical pads directly printed on the metal layers on which an RF connector is soldered. The ability to transfer electric pads in a sealed package is one of the most crucial parts in ohmic-contact microelectromechanical systems (MEMS) as it determines the device performance and reliability, particularly for soft and flexible devices where the electrical connectors are typically difficult to produce.
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